Transistor device with improved source/drain junction architecture and methods of making such a device

ABSTRACT

One illustrative device disclosed herein includes a plurality of source/drain regions positioned in an active region on opposite sides of a gate structure, each of the source/drain regions having a lateral width in a gate length direction of the transistor and a plurality of halo regions, wherein each of the halo regions is positioned under a portion, but not all, of the lateral width of one of the plurality of source/drain regions. A method disclosed herein includes forming a plurality of halo implant regions in an active region, wherein an outer edge of each of the halo implant regions is laterally spaced apart from an adjacent inner edge of an isolation region.

BACKGROUND OF THE INVENTION

1. Field of the Invention

Generally, the present disclosure relates to the manufacture ofsemiconductor devices, and, more specifically, to a transistor devicewith improved source/drain junction architecture and various methods ofmaking such a device.

2. Description of the Related Art

The fabrication of advanced integrated circuits, such as CPU's, storagedevices, ASIC's (application specific integrated circuits) and the like,requires the formation of a large number of circuit elements in a givenchip area according to a specified circuit layout, wherein field effecttransistors (NMOS and PMOS transistors) represent one important type ofcircuit element that substantially determines performance of theintegrated circuits. During the fabrication of complex integratedcircuits using, for instance, MOS technology, millions of transistors,e.g., NMOS transistors and/or PMOS transistors, are formed on asubstrate including a crystalline semiconductor layer. A field effecttransistor, irrespective of whether an NMOS transistor or a PMOStransistor is considered, typically comprises so-called PN junctionsthat are formed by an interface of highly doped regions, referred to asdrain and source regions, with a slightly doped or non-doped channelregion disposed between the highly doped source/drain regions. Devicedesigners are under constant pressure to improve the electricalperformance characteristics of semiconductor devices, such astransistors, and the overall performance capabilities of integratedcircuit devices that incorporate such devices.

Ion implantation is a technique that is employed in many technicalfields to implant dopant ions into a substrate so as to alter thecharacteristics of the substrate or of a specified portion thereof. Forexample, the rapid development of advanced devices in the semiconductorindustry is based on, among other things, the ability to generate highlycomplex dopant profiles within tiny regions of a semiconductingsubstrate by performing advanced implantation techniques through amasking. In implanting specified ions into a substrate, the desiredlateral implant profile may be readily obtained by providingcorrespondingly adapted implantation masks. A desired vertical implantprofile may be achieved by, among other things, controlling theacceleration energy of the ions during the implantation process suchthat the majority of the ions are positioned at a desired depth in thesubstrate. Moreover, by appropriately selecting the dopant dose, i.e.,the number of ions per unit area of the ion beam impinging on asubstrate, comparably high concentrations of atoms may be incorporatedinto a substrate as compared to other doping techniques, such asdiffusion. In the case of an illustrative transistor, ion implantationmay be used to form various doped regions, such as halo implant regions,extension implant regions and deep source/drain implant regions, etc.

An illustrative ion implantation sequence employed in forming anillustrative transistor 30 will now be discussed with reference to FIGS.1A-1D. FIG. 1A depicts the transistor 30 at an early stage offabrication, wherein a gate structure 14 has been formed above asemiconductor substrate 10 in an active region that is defined by ashallow trench isolation structure 12. The gate structure 14 typicallyincludes a gate insulation layer 14A and a conductive gate electrode14B. As shown in FIG. 1A, an implantation mask 17 is formed above thesubstrate so as to expose the transistor. The ion implantation mask 17is typically a patterned layer of photoresist material and it may beformed using traditional photolithography tools and techniques. In oneillustrative embodiment, a plurality of angled ion implantationprocesses are performed to form the schematically depicted so-calledhalo implant regions 15 in the substrate 10. The halo implant regions 15are typically formed by performing a series of two or four angledimplant processes, during which the substrate 10 is rotated 180° or 90°after each of the angled implantation processes is performed. The haloimplant regions 15 are doped with the same type of dopant material as isthe active region of the substrate 10. For example, for an NMOS device,the halo implant regions 15 may be P-doped regions so as to reinforcethe dopants in the P-doped active region. In the case of a PMOS device,the halo implant regions 15 would be N-doped regions. The dopantconcentration of the halo implant regions 15 may vary depending upon theparticular application. The implant angle used in forming the haloimplant regions 15 may also vary depending upon the particularapplication. Among other things, the purpose of the halo implant regions15 is to reduce so-called short channel effects on minimum channellength devices, i.e., the proximity from the left and the right haloimplant regions will help to avoid premature punch-through and keep thethreshold voltage of the transistor device high enough for properfunctionality.

As indicated in FIG. 1B, after the halo implant regions 15 are formed, aso-called extension ion implantation process is typically performed toform so-called extension implant regions 16 in the substrate 10. Theextension implant process is typically performed through the samemasking layer 17 that was used when forming the halo implant regions 15.In the case of an NMOS device, the extension implant regions will beN-doped regions. The concentration of dopant materials in the extensionimplant regions 16 may vary depending upon the particular application.In some embodiments, the extension implant regions 16 may beself-aligned relative to the sidewalls of the gate structure 14. Inother applications, a small sidewall spacer (not shown) may be formedadjacent to the gate structure 14 prior to forming the extension implantregions 16. The extension implant regions 16 typically have a lowerdopant concentration and a shallower depth than that of so-called deepsource/drain implant regions that, as discussed more fully below, willbe formed in the substrate 10.

FIG. 1C depicts the device 30 after several process operations have beenperformed. First, the patterned implant mask 17 used when performing theprocess operations described above in connection with FIGS. 1A-1B isremoved. Then, one or more sidewall spacers 18 are formed proximate thegate structure 14. The spacers 18 may be formed by depositing a layer ofspacer material and thereafter performing an anisotropic etchingprocess. Next, a so-called source/drain doping process is performed onthe transistor 30 by means of an epitaxy and/or ion implantation processto form so-called deep source/drain implant regions 20 in the substrate10. As noted above, the source/drain ion implantation process istypically performed using a higher dopant dose and at a higher implantenergy than the ion implantation process that was performed to form theextension implant regions 16. The halo implant regions 15 have asufficient concentration of counter-dopant materials so as toeffectively overwhelm the dopants implanted during the source/drainimplantation process. As a result, the source/drain implant regions 20effectively stop on the halo implant regions 15.

Thereafter, as shown in FIG. 1D, a heating or anneal process isperformed to form the final source/drain regions 22 for the transistor30. This heating process repairs the damage to the lattice structure ofthe substrate material as a result of the implantation processes and itactivates the implanted dopant materials, i.e., the implanted dopantmaterials are incorporated into the silicon lattice. As depicted, thehalo regions 15 limit the depth of the final source/drain regions 22. Asdevice dimensions are continually being reduced, it is very importantthat the depth of the source/drain regions 22 for a transistor be veryshallow, e.g., approximately 15 nm or less in current-day technologies,and that the implanted dopants are, to the extent possible, fullyactivated. Thus, heating processes such as a flash anneal or a laseranneal are performed for a very short duration, e.g., 1250° C. for aduration of 2-10 milliseconds, and are performed to limit the diffusionof the implanted ions, so as to maintain the desired shallow dopantprofile, while at the same time trying to maximize dopant activation. Ingeneral, the higher the annealing temperature, the greater the extent ofdopant activation. For previous device generations, a typical annealprocess might be a rapid thermal anneal process performed at atemperature of about 1080° C. for a much longer duration of about 1-2seconds. However, the very short millisecond anneal times performed toactivate very shallow source/drain regions are insufficient to cure allof the damages to the substrate resulting from the ion implantationprocesses. After a flash or laser anneal process is performed, thesource/drain regions 22 of the transistor 30 will have an amorphousregion (where there is a sufficient concentration of ions to enable theregion to conduct current) and a semi-amorphous region (where implantedions are not of sufficient concentration or not activated). The depth ofthe amorphous regions may be approximately 3-7 nm and 40-50 nm, for theextension implant regions 16 and the deep source/drain implant regions20, respectively, of the source/drain region 22 of the transistor 30. Asa result, the depth of the semi-amorphous region would tend to overlapwith the PN junction in the source/drain region of the device, which mayresult in higher leakage currents, which tend to reduce the electricalperformance of the resulting device and an integrated circuit deviceincorporating such transistors.

The present disclosure is directed to a transistor device with improvedsource/drain architecture and various methods of making such a devicethat may solve or reduce one or more of the problems identified above.

SUMMARY OF THE INVENTION

The following presents a simplified summary of the invention in order toprovide a basic understanding of some aspects of the invention. Thissummary is not an exhaustive overview of the invention. It is notintended to identify key or critical elements of the invention or todelineate the scope of the invention. Its sole purpose is to presentsome concepts in a simplified form as a prelude to the more detaileddescription that is discussed later.

Generally, the present disclosure is directed to a transistor devicewith improved source/drain junction architecture and various methods ofmaking such a device. In one example, a method disclosed herein includesforming an isolation region in the substrate so as to define an activeregion in the substrate, forming a gate structure above the activeregion and, after forming the gate structure, forming a plurality ofhalo implant regions in the active region, wherein an outer edge of eachof the halo implant regions is laterally spaced apart from an adjacentinner edge of the isolation region.

Another illustrative method involves forming the isolation region in asubstrate so as to define an active region in the substrate, forming agate structure above the active region, after forming the gatestructure, forming a patterned halo implantation mask that has anopening that exposes the gate structure and a portion, but not all, ofthe active region positioned between the gate structure and theisolation region, and performing a plurality of angled ion implantationprocesses through the patterned halo implantation mask to form aplurality of halo implant regions in the substrate.

Yet another illustrative method disclosed herein includes the steps offorming the isolation region in a substrate so as to define an activeregion in the substrate, forming the gate structure above the activeregion, after forming the gate structure, forming a patterned haloimplantation mask that has an opening that exposes the gate structureand a portion, but not all, of the active region positioned between thegate structure and the isolation region, and performing a plurality ofangled ion implantation processes through the patterned haloimplantation mask to form a plurality of halo implant regions in thesubstrate, wherein an outer edge of each of the halo implant regions islaterally spaced apart from an adjacent inner edge of the isolationregion. In this example, the method further includes performing anextension ion implantation process through the patterned haloimplantation mask so as to form a plurality of extension implant regionsin the substrate, wherein an outer edge of each of the extension implantregions is laterally spaced apart from an adjacent inner edge of theisolation region.

One illustrative device disclosed herein includes an isolation regionpositioned in the substrate so as to define an active region in thesubstrate, a gate structure positioned above the substrate, a pluralityof source/drain regions positioned in the active region on oppositesides of the gate structure, each of the source/drain regions having alateral width in a gate length direction of the transistor, and aplurality of halo regions positioned in the active region, wherein eachof the halo regions is positioned under a portion, but not all, of thelateral width of one of the plurality of source/drain regions.

Another illustrative device disclosed herein includes an isolationregion positioned in the substrate that defines an active region in thesubstrate, a gate structure positioned above the substrate, a pluralityof source/drain regions positioned in the active region on oppositesides of the gate structure, wherein each of the source/drain regionsextends to and contacts the isolation region, and a plurality of haloregions positioned in the active region, wherein each of the haloregions has an outer edge that does not extend to and contact theisolation region.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure may be understood by reference to the followingdescription taken in conjunction with the accompanying drawings, inwhich like reference numerals identify like elements, and in which:

FIGS. 1A-1D depict one illustrative prior art process flow for formingdoped halo and source/drain regions in a semiconductor device; and

FIGS. 2A-2G depict one illustrative example of a novel transistor devicedisclosed herein with improved source/drain junction architecture and anillustrative method of making such a device.

While the subject matter disclosed herein is susceptible to variousmodifications and alternative forms, specific embodiments thereof havebeen shown by way of example in the drawings and are herein described indetail. It should be understood, however, that the description herein ofspecific embodiments is not intended to limit the invention to theparticular forms disclosed, but on the contrary, the intention is tocover all modifications, equivalents, and alternatives falling withinthe spirit and scope of the invention as defined by the appended claims.

DETAILED DESCRIPTION

Various illustrative embodiments of the invention are described below.In the interest of clarity, not all features of an actual implementationare described in this specification. It will of course be appreciatedthat in the development of any such actual embodiment, numerousimplementation-specific decisions must be made to achieve thedevelopers' specific goals, such as compliance with system-related andbusiness-related constraints, which will vary from one implementation toanother. Moreover, it will be appreciated that such a development effortmight be complex and time-consuming, but would nevertheless be a routineundertaking for those of ordinary skill in the art having the benefit ofthis disclosure.

The present subject matter will now be described with reference to theattached figures. Various structures, systems and devices areschematically depicted in the drawings for purposes of explanation onlyand so as to not obscure the present disclosure with details that arewell known to those skilled in the art. Nevertheless, the attacheddrawings are included to describe and explain illustrative examples ofthe present disclosure. The words and phrases used herein should beunderstood and interpreted to have a meaning consistent with theunderstanding of those words and phrases by those skilled in therelevant art. No special definition of a term or phrase, i.e., adefinition that is different from the ordinary and customary meaning asunderstood by those skilled in the art, is intended to be implied byconsistent usage of the term or phrase herein. To the extent that a termor phrase is intended to have a special meaning, i.e., a meaning otherthan that understood by skilled artisans, such a special definition willbe expressly set forth in the specification in a definitional mannerthat directly and unequivocally provides the special definition for theterm or phrase.

The present disclosure is directed to a transistor device with improvedsource/drain junction architecture and various methods of making such adevice. As will be readily apparent to those skilled in the art upon acomplete reading of the present application, the present methods andsystems are applicable to a variety of technologies, e.g., NMOS, PMOS,CMOS, etc., and they are readily applicable to a variety of devices,including, but not limited to, logic devices, memory devices, etc. Withreference to the attached drawings, various illustrative embodiments ofthe methods and devices disclosed herein will now be described in moredetail.

FIG. 2A depicts an illustrative transistor device 100 disclosed hereinat an early stage of fabrication, wherein a gate structure 106 has beenformed above a semiconductor substrate 102 in an active region that isdefined by a shallow trench isolation structure 104. The gate structure106 typically includes a gate insulation layer 106A and a conductivegate electrode 106B. The substrate 102 may have a variety ofconfigurations, such as the depicted bulk silicon configuration. Thesubstrate 102 may also have a silicon-on-insulator (SOI) configurationthat includes a bulk silicon layer, a buried insulation layer and anactive layer, wherein semiconductor devices are formed in and above theactive layer. Thus, the terms substrate or semiconductor substrateshould be understood to cover all forms of semiconductor structures. Thesubstrate 102 may also be made of materials other than silicon. As willbe recognized by those skilled in the art after a complete reading ofthe present application, the gate structure 106 may be of any desiredconstruction and comprised of any of a variety of different materials,such as one or more conductive layers made of polysilicon or a metal,etc., and one or more layers of insulating material, such as silicondioxide, a high-k material, etc. Additionally, the gate structure 106for an NMOS transistor may have different material combinations ascompared to a gate structure 106 for a PMOS transistor. Thus, theparticular details of construction of gate structure 106, and the mannerin which the gate structure 106 is formed, should not be considered alimitation of the present invention. For example, the gate structure 106may be made using so-called “gate-first” or “gate-last” techniques.

The drawings below depict one illustrative process flow sequence inwhich halo implant regions, extension implant regions and deepsource/drain regions are formed in that order using the novel methodsdisclosed herein. However, as will be appreciated by those skilled inthe art after a complete reading of the present application, the haloand extension implantation processes may be performed in any desiredorder. Thus, the inventions disclosed herein should not be considered tobe limited to any particular sequence of process operations unless sucha sequence is expressly recited in the attached claims.

Next, as shown in FIG. 2B, a patterned halo ion implantation mask 108 isformed above the substrate 102. The halo ion implantation mask 108 istypically a patterned layer of photoresist material and it may be formedusing traditional photolithography tools and techniques. Using themethods disclosed herein, the halo ion implantation mask 108 is formedsuch that it has an opening 108A that exposes a portion, but not all, ofthe active region between the gate structure 106 and the inner edges104E of the isolation region 104. The height or thickness 108H of thehalo ion implantation mask 108 may vary depending upon the particularapplication and the desired final width of the halo regions to be formedin the substrate 102, as discussed more fully below. In general, allother things being equal, as the height of the halo ion implantationmask 108 is increased, the width of the halo implant regions may bereduced. In one illustrative embodiment, the halo ion implantation mask108 may have an overall height 108H that falls within the range of about100-200 nm. Stated another way, the overall height of the halo ionimplantation mask 108 may be about 80-180 nm taller than the height ofthe gate structure 106. The size of the space 108W between the insideedge 108E of the opening 108A in the halo ion implantation mask 108 andthe corresponding edge 106E of the gate structure 106 may vary dependingupon the particular application. In one illustrative embodiment, thesize of the space 108W may be about 2-3 times the height of the gatestructure 106. In absolute terms, the size of the space 108W may fallwithin the range of about 50-150 nm, depending upon the overall lateralwidth of the source/drain regions. Stated another way, the inner edge108E of the opening 108A may be positioned inward of the inner edge 104Eof the isolation region 104 by a distance 108R that falls within therange of about 20-4000 nm.

FIG. 2C depicts the device 100 after a plurality of angled halo ionimplantation processes 110 are performed through the halo ionimplantation mask 108 to form the schematically depicted halo implantregions 110A in the substrate 102. The halo implant regions 110A aretypically formed by performing a series of two or four angled implantprocesses during which the substrate 102 is rotated 180° or 90°,respectively, after each of the angled implantation processes isperformed. The halo implant regions 110A are doped with the same type ofdopant material as is the active region of the substrate 102. Forexample, for an NMOS device, the halo implant regions 110A may beP-doped regions so as to reinforce the dopants in the P-doped activeregion. In the case of a PMOS device, the halo implant regions 110Awould be N-doped regions. Stated another way, the halo implant regions110A are doped with a dopant material that is opposite to the type ofdopant material that is used to form the doped source/drain regions. Thedopant dose used during the angled halo ion implantation processes 110may vary depending upon the particular application, e.g., the dopantdose may fall within the range of about 5e¹²-5e¹⁴ atoms/cm². The implantangle 110B used during the angled halo ion implantation processes 110may also vary depending upon the particular application, i.e., the angle110B may fall within the range of about 10-30 degrees. In one particularembodiment, the halo implant regions 110A may be formed by performingthe angled halo ion implant processes 110 using a dopant dose of5e¹²-5e¹⁴ atoms/cm² and at an energy level of about 10-30 keV. In thisillustrative example, the halo implant regions 110A may have atpeak-concentration a target depth of about 7-30 nm.

FIG. 2D depicts the device 100 after, in the illustrative processingsequence depicted herein, a substantially vertical, extension ionimplantation process 114 is performed through the same halo implant mask108 to form reduced-width extension implant regions 114A in thesubstrate 102. The extension implant regions 114A have a reduced widthin the sense that the outer edge 114E of the extension implant regions114A do not extend all of the way to the isolation region 104 as iscommon when performing extension implantation processes using prior arttechniques. The reduced-width extension implant regions 114A are formedwith a type of dopant that is opposite to the type of dopant used toform the halo implant regions 110A. For example, for an NMOS device, theextension implant regions 114A are N-doped regions. Conversely, for aPMOS device, the extension implant regions 114A would be P-dopedregions. In this illustrative example, the extension ion implantationprocess 114 was performed using a dopant dose of 1-2e¹⁵ ions/cm² and atan energy level of about 2-5 keV. In this illustrative example, theextension implant regions 114 may have at peak-concentration a targetdepth of about 4-20 nm.

FIG. 2E depicts the device 100 after several process operations wereperformed. First, the halo ion implantation mask 108 was removed byperforming, for example, an ashing process. Then, one or more sidewallspacers 116 were formed proximate the gate structure 106. The spacers116 may be formed by depositing a layer(s) of spacer material andthereafter performing an anisotropic etching process. Thereafter, apatterned source/drain implantation mask 118 was formed above the device100.

Next, as shown in FIG. 2F, a so-called source/drain ion implantationprocess 120 was performed on the device 100 to form so-called deepsource/drain implant regions 120A in the substrate 102. As notedpreviously, the source/drain ion implantation process 120 is typicallyperformed using a higher dopant dose and at a higher implant energy thanthe extension ion implantation process 110. The halo implant regions110A have a sufficient concentration of counter-dopant materials so asto effectively overwhelm the dopants implanted during the source/drainimplantation process 120. As a result, the source/drain implant regions120A effectively stop on the halo implant regions 110A. However, asdepicted in FIG. 2F, the portions of the source/drain implant regions120A that are not located above the halo implant regions 110Aeffectively penetrate to a greater depth into the substrate 102. Thatis, the source/drain implant regions 120A positioned between theoutermost edge 110E of the halo implant regions 110A and the inner edges104E of the isolation region 104 has a greater depth than does theportions of the source/drain regions 120A that are positioned above thehalo implant regions 110A, i.e., the junction depth is deeper where thehalo implant regions 110A are absent. In this illustrative example, thedeep source/drain ion implantation process 120 was performed using adopant dose of 3-4 e¹⁵ atoms/cm² and at an energy level of about 10-25keV. In this illustrative example, the deep source/drain implant regions120A may have at peak-concentration a target depth of about 50-60 nm.

FIG. 2G depicts the device 100 after several process operations havebeen performed. First, the patterned source/drain implantation mask 118was removed by performing another ashing process. Then, a heating oranneal process is performed to repair the damage to the latticestructure of the substrate 102 as a result of the various implantationprocesses and it activates the implanted dopant materials. During theheating process, the implanted dopant materials tend to migrate or moveto at least some degree so as to merge together to at least some extent.In the depicted example, the extension implant regions 114A and the deepsource/drain implant regions 120A merge together to form finalsource/drain regions 122 for the device 100. The dopants implanted toform the halo implant regions 110A have migrated to form final haloregions 110X. The parameters of the heating process may vary dependingon the particular application. In general, the heating process may beperformed at a temperature in the range of about 800-1200° C. for a fewmilliseconds to a few seconds.

As will be appreciated by those skilled in the art after a completereading of the present application, the device 100 depicted in FIG. 2Gpresents a novel source/drain junction architecture as compared to priorart devices. More specifically, in the device 100 depicted herein, theouter edge 110E of the halo implant regions 110A and the final haloregions 110X do not extend all the way to the inner edge 104E of theisolation region 104. That is, there is a space or region 125 (in thegate length direction) between the inner edge 104E of the isolationstructure 104 and the outer edge 110E of the halo implant regions 110Aand the final halo regions 110X. As a result, the junction depth 122X ofthe source/drain regions 122 that are positioned above this region 125where the halo regions 110X are not present is greater than it wouldhave been if the halo regions 110X extended all of the way to the inneredge 104E of the isolation region 104. Stated another way, the portionsof the source/drain regions 120 positioned above the halo regions 110Xhave a shallower junction depth than the junction depth 122X of theportions of the source/drain regions 122 that are positioned above theregion 125 where the halo regions 110X are not present. In oneillustrative embodiment, the portions of the source/drain regions 122positioned above the region 125 may have a junction depth that is about10-25 nm greater than the junction depth of the portions of thesource/drain regions 120 positioned above the halo regions 110X. Thenovel device disclosed herein may prove useful in many applications. Forexample, in the case where the device 100 has source/drain regions 122that are very wide (in the channel length direction), e.g., a lateralwidth of about 200-4000 nm, the novel source/drain junction architecturedisclosed herein permits the formation of source/drain regions 122 withdeeper junction depths at distances that are spaced laterally far enoughfrom the gate structure 106 while still providing the desired shallowerjunction depths for the source/drain regions 122 in areas that arecloser to the gate structure 106, i.e., closer to the actual channelregion of the device 100. Using the novel source/drain junctionarchitecture disclosed herein, some of the leakage currents that wouldoccur if the source/drain regions 122 had a substantially uniformshallow junction depth from the gate structure 106 to the isolationregion 104 may be avoided by increasing the depth of the portion of thesource/drain region 122 at the region 125 where the halo regions 110Xare not present.

As will be appreciated by those skilled in the art after a completereading of the present application, various novel methods and devicesare disclosed herein. One illustrative method disclosed herein involvesforming an isolation region 104 in the substrate 102 so as to define anactive region in the substrate 102, forming a gate structure 106 abovethe active region and, after forming the gate structure 106, forming aplurality of halo implant regions 110A in the active region, wherein anouter edge 110E of each of the halo implant regions 110A is laterallyspaced apart from an adjacent inner edge 104E of the isolation region104.

Another illustrative method involves forming the isolation region 104 inthe substrate 102 so as to define an active region in the substrate 102,forming a gate structure 106 above the active region, after forming thegate structure 106, forming a patterned halo implantation mask 108 thathas an opening 108A that exposes the gate structure 106 and a portion,but not all, of the active region positioned between the gate structure106 and the isolation region 104, and performing a plurality of angledion implantation processes 110 through the patterned halo implantationmask 108 to form a plurality of halo implant regions 110A in thesubstrate 102.

Yet another illustrative method disclosed herein includes the steps offorming the isolation region 104 in a substrate 102 so as to define anactive region in the substrate 102, forming the gate structure 106 abovethe active region, after forming the gate structure 106, forming apatterned halo implantation mask 108 that has an opening 108A thatexposes the gate structure 106 and a portion, but not all, of the activeregion positioned between the gate structure 106 and the isolationregion 104, and performing a plurality of angled ion implantationprocesses 110 through the patterned halo implantation mask 108 to form aplurality of halo implant regions 110A in the substrate 102, wherein anouter edge 110E of each of the halo implant regions 110 is laterallyspaced apart from an adjacent inner edge 104E of the isolation region104. In this example, the method further includes performing anextension ion implantation process 114 through the patterned haloimplantation mask 108 so as to form a plurality of extension implantregions 114A in the substrate 102, wherein an outer edge 114E of each ofthe extension implant regions is laterally spaced apart from an adjacentinner edge 104E of the isolation region 104. Stated another way, each ofthe extension implant regions 114A has first and second portions, andwherein the first portion is positioned above a corresponding haloimplant region 110A and the second portion is positioned adjacent theisolation region 104 and above a portion of the active region where thecorresponding halo implant region 110A is absent.

The subject matter disclosed herein is also directed to variousembodiments of a transistor device. In one example, such a deviceincludes an isolation region 104 positioned in the substrate 102 so asto define an active region in the substrate 102, a gate structure 106positioned above the substrate 102, a plurality of source/drain regions122 positioned in the active region on opposite sides of the gatestructure 106, each of the source/drain regions having a lateral widthin a gate length direction of the transistor, and a plurality of haloregions 110X positioned in the active region, wherein each of the haloregions 110X is positioned under a portion, but not all, of the lateralwidth of one of the plurality of source/drain regions 122.

Another illustrative device disclosed herein includes an isolationregion 104 positioned in the substrate that defines an active region inthe substrate, a gate structure 106 positioned above the substrate 102,a plurality of source/drain regions 122 positioned in the active regionon opposite sides of the gate structure 122, wherein each of thesource/drain regions extends to and contacts the isolation region 104,and a plurality of halo regions 110X positioned in the active region,wherein each of the halo regions 110X has an outer edge 110E that doesnot extend to and contact the isolation region 104.

The particular embodiments disclosed above are illustrative only, as theinvention may be modified and practiced in different but equivalentmanners apparent to those skilled in the art having the benefit of theteachings herein. For example, the process steps set forth above may beperformed in a different order. Furthermore, no limitations are intendedto the details of construction or design herein shown, other than asdescribed in the claims below. It is therefore evident that theparticular embodiments disclosed above may be altered or modified andall such variations are considered within the scope and spirit of theinvention. Accordingly, the protection sought herein is as set forth inthe claims below.

1. A method, comprising: forming an isolation region in a semiconductorsubstrate so as to define an active region in said substrate; forming agate structure above said active region; and after forming said gatestructure, forming a plurality of halo implant regions in said activeregion, wherein an outer edge of each of said halo implant regions islaterally spaced apart from an adjacent inner edge of said isolationregion, wherein forming said plurality of halo implant regionscomprises: forming a patterned halo implantation mask that has anopening that exposes said gate structure and a portion, but not all, ofsaid active region positioned between said gate structure and saidisolation region; and performing a plurality of angled ion implantationprocesses through said patterned halo implantation mask to form saidplurality of halo implant regions.
 2. (canceled)
 3. The method of claim1, further comprising; performing an extension ion implantation processthrough said patterned halo implantation mask so as to form a pluralityof extension implant regions in said substrate, wherein an outer edge ofeach of said extension implant regions is laterally spaced apart from anadjacent inner edge of said isolation region.
 4. The method of claim 3,further comprising; removing said patterned halo implantation mask;forming at least one sidewall spacer adjacent said gate structure; afterforming said at least one sidewall spacer, forming a patternedsource/drain implantation mask above said active region; and performinga source/drain ion implantation process through said patternedsource/drain implantation mask so as to form a plurality of deepsource/drain implant regions in said substrate, each of said deepsource/drain implant regions having first and second portions, saidfirst portion being positioned above a corresponding halo implantregion, said second portion being positioned adjacent said isolationregion and above a portion of said active region where saidcorresponding halo implant region is absent.
 5. The method of claim 1,further comprising performing an anneal process on said substrate. 6.The method of claim 1, wherein said patterned halo implantation mask isformed such that a space between an inner edge of said opening and saidgate structure has a lateral width that is equal to 2-3 times an overallheight of said gate structure.
 7. The method of claim 3, wherein saidhalo implant regions are formed prior to forming said extension implantregions.
 8. The method of claim 3, wherein said extension implantregions are formed prior to forming said halo implant regions.
 9. Amethod, comprising: forming an isolation region in a semiconductorsubstrate so as to define an active region in said substrate; forming agate structure above said active region; after forming said gatestructure, forming a patterned halo implantation mask that has anopening that exposes said gate structure and a portion, but not all, ofsaid active region positioned between said gate structure and saidisolation region; and performing a plurality of angled ion implantationprocesses through said patterned halo implantation mask to form aplurality of halo implant regions in said substrate.
 10. The method ofclaim 9, wherein an outer edge of each of said halo implant regions islaterally spaced apart from an adjacent inner edge of said isolationregion.
 11. The method of claim 9, wherein said patterned haloimplantation mask is formed such that a space between an inner edge ofsaid opening and said gate structure has a lateral width that is equalto 2-3 times an overall height of said gate structure.
 12. The method ofclaim 9, further comprising; performing an extension ion implantationprocess through said patterned halo implantation mask so as to form aplurality of extension implant regions in said substrate.
 13. The methodof claim 12, wherein an outer edge of each of said extension implantregions is laterally spaced apart from an adjacent inner edge of saidisolation region.
 14. The method of claim 13, wherein an outer edge ofeach of said halo implant regions is laterally spaced apart from anadjacent inner edge of said isolation region.
 15. The method of claim12, wherein said halo implant regions are formed prior to forming saidextension implant regions.
 16. The method of claim 12, wherein saidextension implant regions are formed prior to forming said halo implantregions.
 17. A method, comprising: forming an isolation region in asemiconductor substrate so as to define an active region in saidsubstrate; forming a gate structure above said active region; afterforming said gate structure, forming a patterned halo implantation maskthat has an opening that exposes said gate structure and a portion, butnot all, of said active region positioned between said gate structureand said isolation region; performing a plurality of angled ionimplantation processes through said patterned halo implantation mask toform a plurality of halo implant regions in said substrate, wherein anouter edge of each of said halo implant regions is laterally spacedapart from an adjacent inner edge of said isolation region; andperforming an extension ion implantation process through said patternedhalo implantation mask so as to form a plurality of extension implantregions in said substrate, wherein an outer edge of each of saidextension implant regions is laterally spaced apart from said adjacentinner edge of said isolation region.
 18. The method of claim 17, furthercomprising; removing said patterned halo implantation mask; forming atleast one sidewall spacer adjacent said gate structure; after formingsaid at least one sidewall spacer, forming a patterned source/drainimplantation mask above said active region; and performing asource/drain ion implantation process through said patternedsource/drain implantation mask so as to form a plurality of deepsource/drain implant regions in said substrate, each of said deepsource/drain implant regions having first and second portions, saidfirst portion being positioned above a corresponding halo implantregion, said second portion being positioned adjacent said isolationregion and above a portion of said active region where saidcorresponding halo implant region is absent.
 19. The method of claim 17,further comprising performing an anneal process on said substrate. 20.The method of claim 17, wherein said halo implant regions are formedprior to forming said extension implant regions.
 21. The method of claim17, wherein said extension implant regions are formed prior to formingsaid halo implant regions. 22.-32. (canceled)